SAN FRANCISCO, November 18, 2025 — Via Licensing Alliance has announced a formal call for patents for its first semiconductor patent pool, focused on memory technologies. This announcement follows Via’s recent declaration that it is in the process of forming a series of patent pools within the semiconductor space. The initial pool will address licensing for… Continue reading Via Licensing Alliance Announces Call for Patents for First Semiconductor Patent Pool, Focused on Memory Technologies
Category: Press Releases
LG Electronics Joins Via LA’s Qi Wireless Charging Patent Pool as Both a Licensor and Licensee
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Fraunhofer and IP Bridge Join LTE Pool, Further Expanding International Impact of Via’s Collaborative Licensing Patent Program
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Fraunhofer and IP Bridge Join LTE Pool, Further Expanding International Impact of Via’s Collaborative Licensing Patent Program
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Fraunhofer and IP Bridge Join LTE Pool, Further Expanding International Impact of Via’s Collaborative Licensing Patent Program
Via LA Welcomes vivo Into Advanced Audio Coding Patent Pool
Fraunhofer and IP Bridge Join LTE Pool, Further Expanding International Impact of Via’s Collaborative Licensing Patent Program
Via LA Announces Extension of HEVC Patent Pool to Include VVC and Welcomes TCL Into Newly Formed Program
Fraunhofer and IP Bridge Join LTE Pool, Further Expanding International Impact of Via’s Collaborative Licensing Patent Program
Via Licensing Alliance’s ATSC 3.0 Broadcast Patent Pool Builds Momentum with Three New Members
Fraunhofer and IP Bridge Join LTE Pool, Further Expanding International Impact of Via’s Collaborative Licensing Patent Program
Skyworth Group Joins Via LA’s Advanced Audio Coding Patent Pool
Fraunhofer and IP Bridge Join LTE Pool, Further Expanding International Impact of Via’s Collaborative Licensing Patent Program
TCL Joins Via Licensing Alliance’s ATSC 3.0 Broadcasting Patent Pool
Fraunhofer and IP Bridge Join LTE Pool, Further Expanding International Impact of Via’s Collaborative Licensing Patent Program